| 发明名称 |
Electroless copper plating solutions and methods of use thereof |
| 摘要 |
Electroless copper plating solutions and methods of use thereof are disclosed. A representative electroless copper plating solution includes a reducing agent that is a source of hypophosphite ions and at least one accelerator compound that accelerates the rate of copper deposition.
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| 申请公布号 |
US6875474(B2) |
申请公布日期 |
2005.04.05 |
| 申请号 |
US20020288744 |
申请日期 |
2002.11.06 |
| 申请人 |
GEORGIA TECH RESEARCH CORPORATION |
发明人 |
KOHL PAUL A.;LI JUN |
| 分类号 |
C23C18/40;(IPC1-7):B05D1/18 |
主分类号 |
C23C18/40 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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