| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an apparatus and method for mounting electronic components which can carry out solder bonding with the most suitable heating pattern for each electronic component and can achieve size reduction and energy efficiency improvement of the electronic component mounting line. <P>SOLUTION: The electronic component mounting apparatus for mounting an electronic component on a substrate 3 with solder bonding includes a component loading mechanism for loading an electronic component by taking out the electronic component from a component supply section, transferring the component to the substrate 3, and loading the component on the component mounting position 3a, with a loading head 15, and a localized heating means for locally heating the electronic component loaded on the component mounting position 3a with a hot wind ejection nozzle 19 of a heating head 18 to heat and melt the solder S supplied beforehand to the bonding portion between electrodes 3b for connection and terminals of the electronic component, wherein the component loading mechanism and the localized heating means are arranged opposedly interposing the substrate 3 within the same apparatus. Thereby, it is possible to eliminate a reflow furnace of a large equipment length in the electronic component mounting line. <P>COPYRIGHT: (C)2008,JPO&INPIT |
