Manufacturing method for thermoelectric conversion device

摘要

An insulating substrate is prepared. In this substrate, plural via holes penetrating in a thickness direction are filled with a conductive paste. This paste is produced by adding an organic solvent to a powder of an, and by processing the power of the alloy to a paste. The substrate is then pressed from a front surface and a back surface of the substrate, while being heated. The conductive paste is solid-phase sintered and interlayer connecting members are formed. A front surface protective member is disposed on a front surface of the substrate and a back surface protective member is disposed on a back surface of the substrate, and a laminate is formed. The laminate is integrated by a lower pressure being applied while heating at a lower temperature, compared to the temperature and pressure in the process of forming the interlayer connecting members.

主权项

1. A manufacturing method for a thermoelectric conversion device comprising:
a step of preparing an insulating substrate that is configured to contain a thermoplastic resin, in which a plurality of via holes that penetrate in a thickness direction are formed, and the via holes are filled with a conductive paste that is produced by adding an organic solvent to a powder of an alloy in which a plurality of metal atoms retain a predetermined crystalline structure, and by processing the powder of the alloy into a paste; a step of solid-phase sintering the conductive paste and forming interlayer connecting members by pressing the insulating substrate from a front surface of the insulating substrate and a back surface on a side opposite to that of the front surface, while heating; a step of forming a laminate by disposing a front surface protective member having front surface patterns that come into contact with predetermined interlayer connecting members on the front surface of the insulating substrate and disposing a back surface protective member having back surface patterns that come into contact with predetermined interlayer connecting members on the back surface of the insulating substrate; and a step of integrating the laminate while electrically connecting the interlayer connecting members to the front surface patterns and the back surface patterns, by pressing the laminate from the lamination direction while heating, wherein in the step of integrating the laminate, a lower pressurizing force is applied while heating at a lower temperature, compared to the temperature and pressurizing force in the step of forming the interlayer connecting members.