发明名称 半導体装置の製造方法
摘要 A method for producing a semiconductor device having a nitride-based semiconductor layer includes forming a first nitride-based semiconductor layer of AlxGa1-xN on a base; forming a second nitride-based semiconductor layer of AlyGa1-yN on the first nitride-based semiconductor layer; forming a third nitride-based semiconductor layer of AlzGa1-zN on the second nitride-based semiconductor layer; introducing an impurity using ion implantation into the first, second, and third nitride-based semiconductor layers; and thermally treating, after ion implantation, the first, second, and third nitride-based semiconductor layers, wherein the first, second, and third nitride-based semiconductor layers have respective Al composition ratios x, y, and z, and the Al composition ratio y of the second nitride-based semiconductor layer is higher than the Al composition ratio x of the first nitride-based semiconductor layer, and higher than the Al composition ratio z of the third nitride-based semiconductor layer.
申请公布号 JP6052420(B2) 申请公布日期 2016.12.27
申请号 JP20150534058 申请日期 2014.06.27
申请人 富士電機株式会社 发明人 田中 亮;高島 信也;上野 勝典;江戸 雅晴
分类号 H01L21/336;H01L21/265;H01L29/12;H01L29/78 主分类号 H01L21/336
代理机构 代理人
主权项
地址