| 摘要 |
PURPOSE:To lower an amount of the humidity remaining in the apparatus and more efficiently dry up semiconductor wafer by respectively controlling a fluid measuring portion, a high speed rotation driving portion and forced exhaustion driving portion with CPU. CONSTITUTION:A semiconductor wafer is set in an accommodation carrier 7 and the purified air is sent to the inside of case 4 of drying portion through the air supply nozzle 2 from the fluid measuring portion 1 when a hermetically sealed cover 3 is closed. At this time, amount of purified air is preset by the CPU built in a control portion 10. Almost simultaneously, a high speed rotating motor M2 of the high speed rotation driving portion 5 controlled by the CPU and a forced exhaustion motor M1 of the forced exhaustion driving portion 8 start and thereby water is sprashed by a centrifugal force due to the rotation of an accommodating carrier 7. Moreover, contaminated air containing water is exhausted from an exhaust duct 9. At this time, the optimum purification and drying process conforming to the setting condition can be obtained by presetting into the CPU the correlations between the number of rotations of high speed motor and amount of sprashed water, and between the amount of purified air and time, and between a number of rotations of high speed motor and the amount of contaminated gas. |
