| 摘要 |
Batch practices of magnetic film deposition and circuit structuring are merged upon a common semiconductor substrate (chip) for both circuit and head parts. As to any one head being formed, the substrate is suitably doped and metallized to form electronics designed for cooperation with such head; then, thin films (cores) of magnetic material are deposited on the semiconductor substrate for cooperation with the electronics. After the thin film head cores are appropriately gapped, a (common) yoke is brought into contact with them . . . the substrate being thereafter contoured through its underside to expose the thin film core gaps.
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