| 摘要 |
A placement mechanism for vertically displacing a micro-electronic component to place the component on a printed circuit board. The mechanism has a spindle that is displaceable on a vertical axis and rotatable on the vertical axis to align the component leads with the lands of the circuit on the board. The spindle carries a placement rod in communication with a vacuum source to enable the component to be retrieved and placed on the board. The placement rod has a resilient interconnection with the spindle to allow for varying board heights and to buffer the impact of the placement of the component on the board.
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