| 摘要 |
Pins are inserted sequentially into a component by an insertion punch. A shuttle reciprocally mounted to move in a direction normal to the movement of a punch, moves pins to a position for insertion. In one form of apparatus, pins are fed singly to the shuttle at a loading position, the shuttle then moving to a dispensing position where the punch grips the pin, removes it from the shuttle and inserts it. While moving from the loading position to the dispensing position, the pin can pass beneath a solder preform station at which an annular preform is placed over the pin. In an alternative arrangement, pins are mounted on a bandolier and moved by the shuttle. Pins are removed one at a time from the bandolier and inserted by the insertion punch.
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