| 摘要 |
<p>In the process described, the electronic circuits (2) for the signal processing and the sensor structures to which they are coupled are manufactured side by side on a common substrate (1). The process is characterized by the following steps: manufacture of the electronic circuits on the substrate (1) by known semiconductor techniques; application of a galvanic electrode (7) to the substrate (1); application on the substrate of a layer of an X-ray resist (8), the thickness of which corresponds to a characteristic height of the sensor structures; production of negatives (10, 11) of the sensor structures in this layer (8) by X-ray lithography; galvanic deposition of a metal (12, 13) or a metal alloy in the negatives (10, 11) of the sensor structures; division of the substrate with the sensor structures applied thereto into separate functional units (chips).</p> |
