| 摘要 |
The moulded layer seals a semiconductor chip (4), a bed part (21), a set of bonding wires (6) and a heat sink (1) which has a gap of a prescribed distance between the heat sink (1) and the back of the bed part (21). The layer comprises a moulded layer (31) which seals to expose the back of the bed part and a second moulded layer (32) is formed to cover sides of the heat sink (1) and of the first moulded layer (31). The intermediate parts of the leads (2) are coupled to the chip via the bonding wires, and the gap is filled with the 2nd layer (32) between the bed part (21) and the heat sink (1). A part of the first layer can be unfilled by a notch or through-hole. |
