| 发明名称 |
HIGH DENSITY BOND PAD DESIGN |
| 摘要 |
A semiconductor chip package having a top surface with a recessed chip carrying cavity, and a double row of staggered single tier bonding pads placed around the cavity. |
| 申请公布号 |
CA2009723(A1) |
申请公布日期 |
1990.08.10 |
| 申请号 |
CA19902009723 |
申请日期 |
1990.02.09 |
| 申请人 |
HONEYWELL INC. |
发明人 |
DUNAWAY, THOMAS J.;SPIELBERGER, RICHARD K. |
| 分类号 |
H01L21/60;H01L23/498 |
主分类号 |
H01L21/60 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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