| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition small in roughness of an insulation layer surface in a wet roughing process, capable of forming a plating conductor layer having sufficient strength and excellent in dielectric property and thermal expansion coefficient.SOLUTION: There is provided a resin composition containing a cyanate ester resin and a naphthylene ether type epoxy resin. There is provided a resin composition having (A) content of the cyanate ester resin of 2 to 50 mass% and (B) content of the naphthylene ether type epoxy resin of 1 to 40 mass% based on 100 mass% of a nonvolatile component of the resin composition. There is provided a resin composition preferably further containing (C) an inorganic filler, (D) a curing accelerator, (E) an epoxy resin (excluding the naphthylene ether type epoxy resin) and (F) an active ester curing agent.SELECTED DRAWING: None |
