| 摘要 |
An epoxy resin compsn. for sealing a semiconductor comprises 7-20 wt.pts. of multifunctional epoxy cpd., 0.1-13 wt. pts. of imide- modified silicon cpd. mfd. by the reaction of polysiloxane and imide, 2.5-15 wt. pts. of novolak -phenol resin, and 60-80 wt. pts. of inorganic filler. The filler is pref. molten silica, zirconium oxide, clay, alumina, calcium carbonate, aluminium hydroxide, cement and/or graphite. The compsn. has a low stress and a good moldability. |
