发明名称 |
DEVICE FOR CUTTING GLASS PLATE |
摘要 |
<p>A device for cutting a glass plate, which device is capable of cutting even a thick glass plate resistant to cracking (development of split), along a cutting line. The device comprises: a sucking disk unit (21) to lift the glass plate (1); a support table (39) to support the glass plate flat; cutting mechanisms (9, 10); a first transfer unit to transfer said cutting mechanisms on the polar coordinate plane on the glass plate surface; a glass plate receiving body (37) to support the glass plate in a position opposite to said cutting mechanisms and a cracking unit (38) to exercise cracking; a second transfer unit to transfer said glass plate receiving body and cracking unit on the polar coordinate plane on the glass plate surface; and a control unit to control cutting operation of the cutting mechanisms, operation of the first and second transfer units, and cracking operation of the cracking unit. <IMAGE></p> |
申请公布号 |
EP0491055(A4) |
申请公布日期 |
1993.01.13 |
申请号 |
EP19910911755 |
申请日期 |
1991.07.03 |
申请人 |
BANDO KIKO CO. LTD. |
发明人 |
BANDO, SHIGERU, 2-38, JYOTOCHO 1-CHOME |
分类号 |
B26F3/00;C03B33/023;C03B33/033;C03B33/037;C03B33/04;(IPC1-7):C03B33/03 |
主分类号 |
B26F3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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