| 摘要 |
PROBLEM TO BE SOLVED: To provide a bare chip transfer unit and a semiconductor mounting device, which pick a bare chip on a lateral face and which have high yield and high versatility.SOLUTION: A semiconductor mounting device comprises: a chucking part (chuck pins 11) which contacts a lateral face of a bare chip 3 for mechanically chucking the bare chip 3; and a rotary member which rotates simultaneously with the chucking part (chuck pins 11). The semiconductor mounting device further comprises a bare chip chucking unit (collet 1) in which rotation of the rotation member is inhibited by contact of the chucking part (chuck pins 11) with the lateral face of the bare chip 3, and the bare chip 3 is held by a force of the rotation member trying to rotate. |
