Printed circuit board for electronical power circuit containing power semiconductors.

摘要

The invention relates to a printed-circuit board for a power electronics circuit having power semi-conductors (5), fitted as SMDs on one side, the unfitted side of the printed-circuit board, which consists of a steel hybrid substrate (1) with conductor tracks (3) which are printed thereon on one side and can be connected to connecting contacts (7) of the power semi-conductors (5), being capable of connection to a heat sink (4). In order to achieve heat dissipation which is as good as possible it is provided that metallic islands (6), which are electrically insulated from the conductor tracks (3) and correspond to the size of the power semi-conductors (5), are printed on the component side of the printed-circuit board, the power semi-conductors (5) being capable of being soldered flat on to the metallic islands (6).