ONE-LAYER WIRING TCP TAPE

摘要

PURPOSE: To obtain TCP strong in a repeated bending test by a method wherein a one-layer wiring TCP tape with no adhesive is composed of a polyimide base film, a copper foil layer and a solder resist coat film of a polyimide solder resist ink. CONSTITUTION: A one-layer wiring TCP tape is formed by using no adhesive with a base film 3 of a thickness 6 to 75μm; a copper foil layer 1 formed with a one-layer wiring layer of a thickness 4 to 25μm and of a pitch between wires 100μm or less; and a solder resist coating layer 2 of a thickness 6 to 60μm covering a wiring layer. The copper foil layer 1 is obtained by casting of the base film 3 and cure heat treatment. After the solder resist coating layer 2 is subjected to the cure heat treatment at 350 deg.C or less, the characteristics are heat pulling strength is 20 to 30kgf/mm<2> and bending elastic coefficient is 3000 to 5000kgf/m<2> . The solder resist coating layer 2 is an epoxy resin ink polyimide system ink.