| 摘要 |
PCT No. PCT/GB97/01792 Sec. 371 Date Aug. 18, 1999 Sec. 102(e) Date Aug. 18, 1999 PCT Filed Jul. 3, 1997 PCT Pub. No. WO98/02963 PCT Pub. Date Jan. 22, 1998A semiconductor switch die (30) is mounted on one face of a substrate (31) and has a temperature sensor (10) on the opposite face to monitor the temperature in the vicinity of the semiconductor die. A current sensor (4) and voltage sensor (5) supply signals to a processor (15) to calculate power dissipated by the semiconductor device. The processor calculates the temperature of the device itself from the measured temperature and the dissipated power. If this exceeds a preset limit, the switching device is opened to prevent damage. |
