| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor light emitting element wherein a device configuration where a plurality of laser lights of different wavelength is used is simplified for reduction in size. SOLUTION: Electrodes 14 of semiconductor light emitting elements 1 and 3 are so provided as to sandwich such solder material metal 26 as In, Sn, etc., with a joint part heated and bonded. Light emitting points 2 and 4 of the semiconductor light emitting elements 1 and 3 are positioned on the electrode 14 of a chip end, which is very closely arranged at an interval WA between light emitting points such as 100μm or shorter. Thus, the optical path of the laser light for a DVD and that for a CD and CD-R can be constructed with a single system, so surplus parts in a system are reduced for smaller and lighter weight.
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