发明名称 |
METHOD OF COOLING SOLDERED PRODUCT, SOLDERED PRODUCT COOLING APPARATUS AND SOLDERING APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To obtain a method and apparatus for cooling a work to be soldered, whereby the work can be cooled quickly. SOLUTION: An ultrasonic atomizer 12 is provided for feeding finely atomized mist to a work to be soldered, immediately after soldering. The atomizer 12 has an ultrasonic oscillator 15 disposed at the bottom of a liq. tank 13 for finely atomizing a liq. 18 in the liq. tank 13. The liq. 18 uses demineralized water. The liq. temp. in the tank 13 is held at a set temp. by a thermo module 16 disposed at the lower side of the tank 13. A gas barrier forming piping 31, for forming a gas barrier over the entire circumstance of the tank 13, is disposed on the inner side surface of the tank 13. |
申请公布号 |
JP2000332401(A) |
申请公布日期 |
2000.11.30 |
申请号 |
JP19990136856 |
申请日期 |
1999.05.18 |
申请人 |
TAMURA SEISAKUSHO CO LTD;TAMURA FA SYSTEM:KK |
发明人 |
ABE NOBUHIDE;OKANO TERUO;IMAI HIDEKAZU;FUJIKAWA SHINICHI |
分类号 |
B23K1/00;B23K1/008;B23K1/08;B23K31/02;B23K101/40;H05K3/34;(IPC1-7):H05K3/34 |
主分类号 |
B23K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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