发明名称 METHOD OF COOLING SOLDERED PRODUCT, SOLDERED PRODUCT COOLING APPARATUS AND SOLDERING APPARATUS
摘要 PROBLEM TO BE SOLVED: To obtain a method and apparatus for cooling a work to be soldered, whereby the work can be cooled quickly. SOLUTION: An ultrasonic atomizer 12 is provided for feeding finely atomized mist to a work to be soldered, immediately after soldering. The atomizer 12 has an ultrasonic oscillator 15 disposed at the bottom of a liq. tank 13 for finely atomizing a liq. 18 in the liq. tank 13. The liq. 18 uses demineralized water. The liq. temp. in the tank 13 is held at a set temp. by a thermo module 16 disposed at the lower side of the tank 13. A gas barrier forming piping 31, for forming a gas barrier over the entire circumstance of the tank 13, is disposed on the inner side surface of the tank 13.
申请公布号 JP2000332401(A) 申请公布日期 2000.11.30
申请号 JP19990136856 申请日期 1999.05.18
申请人 TAMURA SEISAKUSHO CO LTD;TAMURA FA SYSTEM:KK 发明人 ABE NOBUHIDE;OKANO TERUO;IMAI HIDEKAZU;FUJIKAWA SHINICHI
分类号 B23K1/00;B23K1/008;B23K1/08;B23K31/02;B23K101/40;H05K3/34;(IPC1-7):H05K3/34 主分类号 B23K1/00
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