| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent lowering of washing performance, prevent contamination of a wafer and a semiconductor manufacturing device effectively and prevent lowering of a product and yield even if discharge control of washing solution deviates from a proper state. SOLUTION: The part of a rear side of a wafer chuck 40 is provided with a plurality of screens 44 and a path 45 of washing solution formed of adjacent screens 44. Washing solution discharged from a discharge nozzle 46 is taken into a suction port. When washing solution is discharged from a discharge nozzle while a wafer 35 is sucked and fixed to the wafer chuck 40 and is rotated at a prescribed speed, washing solution enters the path 45 from a suction port and flows in the path 45 by rotation from a central part of the wafer chuck 40 toward an outer circumferential part thereof. Washing solution which reached an outer circumferential part is discharged from an outer circumferential part toward an outside of a radius direction and diffused, thus reaching the rear of the wafer 35.</p> |
