BONDING RESIN COMPOSITION

摘要

PROBLEM TO BE SOLVED: To obtain a thermoplastic resin composition which is capable of bonding within a short time without using a heating furnace to thereby give a high adhesive strength at 80 deg.C between glass and an inorganic-reinforced thermoplastic resin. SOLUTION: The bonding resin composition is characterized by containing (A) a heating unit to generate heat by means of radiofrequency induction and (B) a thermoplastic resin which is modified with a monomer containing a functional group reactive with an inorganic substance in the presence of water and which has a melting point at 90 deg.C-200 deg.C.