SUBSTRATE TREATING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a treating apparatus with which both the upper and under surfaces of a semiconductor wafer can be cleaned simultaneously and the wafer can be dried after cleaning. SOLUTION: The substrate treating apparatus is provided with a first rotation driving means 2, which drives the rotation of a semiconductor wafer 1 by holding its edge by a roller 12 driven for rotation, an upper part treating means 31, which has an upper part cleaning tool 33 for cleaning the upper surface of the semiconductor wafer 1 held by the rotation driving means 2, an under part treating means 32 with which an under part cleaning tool 1 for cleaning the under surface of the semiconductor wafer 1 held by the first rotation holding means is provided replaceably and means 57 and 62 for causing a lower arm 53 for replacing the under part cleaning tool 1 of the under part cleaning means 32 with a holding tool 77 to turn and to move vertically.