| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a build-up type printed wiring board which enables a pat-on-via structure by which a drilling process by laser can be skipped and via holes of a small diameter can be filled in. SOLUTION: A first metal foil 2 and a group of conductor bumps 3, 3,... are printed, and then an insulation substrate precursor 4 and a second metal foil 5 are laid on top of the first metal foil and the group of conductor bumps 3, 3,..., and these are heat-pressed to form a laminate 10. A group of conductor bumps 6, 6,... is formed on a wiring pattern 2a obtained by patterning the laminate 10, and then an insulation substrate precursor 16 and another two-layer board 20a are laid and aligned on top of the group of conductor bumps 6, 6,..., and all these are heat-pressed. |
