| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermoelectric module and a method of manufacturing the same, a thermoelectric device, and a fiber projector which are advantageous for securing bonding strength of a thermoelectric chip. SOLUTION: The thermoelectric module 2 comprises a first substrate 22 with a first electrode 21, a second substrate having a second electrode, and a plurality of thermoelectric chips 25, each of which is formed of a thermoelectric material and is coated with an Ni-based plated layer 30 on the surface. The Ni-based plated layer 30A of the thermoelectric chip 25 is bonded to the first electrode 21 of the first substrate 22 and the second electrode of the second substrate, by a solder layer 27 for bonding a chip which has a higher lead-free level. As a result, each thermoelectric chip 25 is disposed between the first electrode 21 and the second electrode, and at the same time, are electrically connected to the first electrode 21 and the second electrode. The solder layer 27 for bonding a chip is formed of an Sn-Sb-based alloy, including 6 to 15% of Sb in terms of the weight ratio. Between the solder layer 27 and the Ni-based plated layer 30A, an Ni-Sn-Sb-based alloy reinforcement layer 28 is formed.
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