发明名称 VACUUM APPARATUS FOR FIXING WAFER
摘要 PURPOSE: A vacuum apparatus for fixing a wafer is provided to absorb stably the wafer regardless of a warpage phenomenon of the wafer by minimizing the physical force applied to the wafer. CONSTITUTION: A fixing table(130) includes an absorbing plate(132) in order to absorb a wafer(110) by using the vacuum. A vacuum forming cover(140) is used for defining a vacuum space(150) from an upper portion of the absorbing plate. The vacuum forming cover has a plurality of holes(120) for injecting the air(152) into the vacuum space. A wafer transferring arm(160) is used for transferring the wafer in order to adhere the wafer on the absorbing plate. The plural holes are formed on predetermined positions of the upper wall corresponding to an edge portion of a wafer adhered on the absorbing plate.
申请公布号 KR20030042907(A) 申请公布日期 2003.06.02
申请号 KR20010073738 申请日期 2001.11.26
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LIM, SANG SUN
分类号 H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/68
代理机构 代理人
主权项
地址