| 摘要 |
PROBLEM TO BE SOLVED: To solve the difficulty of recognizing the tip of a probe in a probe device for testing a semiconductor wafer resulting from capturing of a reflection image of the probe axis in addition to that of the probe tip upon illumination of the probe tip by a plurality of light sources provided around an imaging section. SOLUTION: Light sources are provided around the imaging section at four points, each being 90 degrees off a neighboring one, to illuminate the probe tip from the four directions. The light sources are put into a light-emitting state sequentially one by one, thereby obtaining four irradiation patterns. Based on images A-D of the probe tip obtained from the respective irradiation patterns, an optimum irradiation pattern is selected for use for recognition of the probe tip. Alternatively, images from the respective irradiation patterns may be composed into binary images, for example, so that a bright region common to the four binary images may be determined and recognized as the probe tip. COPYRIGHT: (C)2003,JPO
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