| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead-free solder material which is suitable as the high temperature side solder material in a stepping soldering process and has good heat-resistance. SOLUTION: This solder material is composed of an alloy containing 25-40 wt.% Ag, 24-43 wt.% Sb and the balance Sn, and has at least≥250°C fusing point and further, is formed as a paste by mixing the above alloy powder and a flux. COPYRIGHT: (C)2004,JPO
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