| 摘要 |
An encapsulation method for an organic light emitting diode, comprising: dividing, on an encapsulation substrate (20), positions for sticking glass cloth adhesive tapes (40); sticking the glass cloth adhesive tapes (40) on the positions; bonding an organic light emitting diode substrate (10) to the encapsulation substrate (20); and melting the glass cloth adhesive tapes (40), so that the organic light emitting diode substrate (10) and the encapsulation substrate (20) are welded together, so that a welding seam can be avoided, and external air cannot enter an encapsulation body, thereby improving the service life of an OLED. |
