ADHESIVE AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To obtain an adhesive with a high moisture resistance by compounding a silicone-modified polyimide resin contg. a specified amt. of a silicone diamine with an epoxy compd. and a compd. having active hydrogen atoms reactive with an epoxy compd. SOLUTION: A silicone-modified polyimide resin contg. 5-50mol% (based on the total amines) silicone diamine represented by the formula (wherein R is a divalent 1-4C aliph. group, etc.; R<1> is a monovalent aliph. group, etc.; and (n) is 1-20) is compounded with an epoxy resin (e.g. bisphenol A glycidyl ether) and a compd. (e.g. a resol resin) having active hydrogen atoms reactive with an epoxy compd. in a compounding ratio given by the area shown in the three- component phase diagram, giving a resin compsn. An adhesive comprising the compsn. is used for bonding a semiconductor element to a carrier substrate having the inside and the outside conductive part. The adhesive after cured exhibits solubility parameters at 30 deg.C and 85 deg.C of 1×10<-3> kg/m<3> /Pa or lower and 0.1×10<-3> kg/m<3> /Pa or lower, respectively, and an adhesive strength under wet hot conditions of 1.5×10<5> Pa or higher.