| 摘要 |
PROBLEM TO BE SOLVED: To simply perform the observation work of a device chip in a short time even if there is the mounting error of a wafer or the manufacturing error of the device chip. SOLUTION: A waver inspecting apparatus includes a work stage 2 having the wafer 1 on which the device chip is formed and which is set, a first moving means 3, 4 for moving the work stage 2 in three-dimensional directions of X, Y and Z, a first rotating means 5 for horizontally rotating the work stage 2, a probing unit 11 having a probe 6 for probing the device chip, a second moving means 7, 8 for moving the first moving means 3, 4 and the probing unit 11 integrally in the three-dimensional directions of the X, the Y and the Z, a microscope 12 for observing the device chip on the wafer 1, and a position correcting means 10 for correcting the observation position of the device chip. COPYRIGHT: (C)2004,JPO&NCIPI |
