摘要 |
<P>PROBLEM TO BE SOLVED: To provide a chemically amplifying positive photoresist composition for a thick film which has a favorable shape of a product by plating, excellent plating resistance and high contrast and which is suitable for manufacturing a connecting terminal or the like, and to provide a thick film photoresist layered body, a method for manufacturing a thick film resist pattern by using the above body, and a method for manufacturing a connecting terminal. <P>SOLUTION: The chemically amplifying positive photoresist composition for a thick film is used to form a thick film photoresist layer of 10 to 150 μm film thickness on a supporting body. The composition contains: (A) a compound which generates an acid by irradiation of active rays or radiation; and (B) a resin which increases the solubility with an alkali by the effect of an acid. The (B) component contains (b1) a resin comprising a copolymer containing a structural unit having a specified structure. <P>COPYRIGHT: (C)2005,JPO&NCIPI |