| 发明名称 | Package structure with an elastomer with lower elastic modulus | ||
| 摘要 | A package structure includes a substrate, at least one electronic component, a housing and at least one strut. The at least one electronic component is disposed on a first surface of the substrate. The housing covers the first surface of the substrate. The housing has an accommodation space. The at least one electronic component is accommodated within the accommodation space. The at least one strut is protruded from an inner surface of the housing and extended toward the accommodation space. The at least one elastomer is arranged between the corresponding strut and the substrate. | ||
| 申请公布号 | US9633919(B2) | 申请公布日期 | 2017.04.25 |
| 申请号 | US201615068212 | 申请日期 | 2016.03.11 |
| 申请人 | DELTA ELECTRONICS (SHANGHAI) CO., LTD. | 发明人 | Wan Zhengfen;Wang Tao;Zhao Zhenqing;Cheng Wei;Xu Haibin |
| 分类号 | H01L23/12;H01L29/66;H01L23/24;H01L23/04;H01L23/00;H01L25/07;H01L23/40 | 主分类号 | H01L23/12 |
| 代理机构 | Kirton McConkie | 代理人 | Kirton McConkie ;Witt Evan R. |
| 主权项 | 1. A package structure, comprising: a substrate; at least one electronic component disposed on a first surface of the substrate; a housing disposed on the first surface of the substrate for covering the first surface of the substrate, wherein the housing has an accommodation space, and the at least one electronic component is accommodated within the accommodation space; at least one strut protruded from an inner surface of the housing and extended toward the accommodation space; and at least one elastomer arranged between the corresponding strut and the substrate, wherein pressure from the corresponding strut is transmitted to the substrate through the at least one elastomer, wherein an elastic modulus of the at least one elastomer is lower than 1000 MPa. | ||
| 地址 | Shanghai CN | ||