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发明名称
SEMICONDUCTOR DEVICE
摘要
<p>PURPOSE:To prevent breakdown of the device owing to thermal stress by brazing the pellet after allowing heat to radiate therefrom through silver buffer plates.</p>
申请公布号
JPS52147065(A)
申请公布日期
1977.12.07
申请号
JP19760064866
申请日期
1976.06.01
申请人
发明人
分类号
H01L21/52;H01L23/48
主分类号
H01L21/52
代理机构
代理人
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地址
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