| 摘要 |
PURPOSE:To avoid junction shortcircuiting due to attachment of solder by placing the bottom surface of a lead frame for mounting a semiconductor pellet at both sides of which are exposed the ends of a pn-junction, one step higher than th bottom surface of a reflector plate placed around the lead frame. CONSTITUTION:Light emitting diode pellet 4 on both sides of which are exposed the ends of a pn-junction is fixed to a light emitting diode lead frame. On the surrounding edge of this lead frame is provided depressed reflector plate 1' forming an inverted cone surface or paraboroidal surface in the direction of discharging light. Pellet 4 is fixed to the bottom of the flame surrounded by this. At this time, the shape of the bottom is made as follows. That is, the bottom is not made flat, but matching with the size of pellet 4, cylindrical support 6, one step higher, is provided, and groove 7 is cut around this. By this, even if pellet 4 fixed on support 6 by using silver paste 2', junction 3 is not shorted by swelling. |
