发明名称 |
Epoxy resin composition |
摘要 |
An epoxy resin composition comprising (1) about 20 to about 80% by weight of a solid epoxy resin, and (2) about 80 to about 20% by weight of a solid resole-type phenolic resin having a softening point of about 70 DEG to about 90 DEG C., a gel time at 150 DEG C. of at least about 80 seconds and a methylol index of about 25 to about 45, said phenolic resin being a condensation product of 1 mol of a phenol with 1 to about 4 mols of an aldehyde.
|
申请公布号 |
US4367318(A) |
申请公布日期 |
1983.01.04 |
申请号 |
US19800124896 |
申请日期 |
1980.02.26 |
申请人 |
ASAHI YAKIZAI KOGYO CO.;ASAHI KASEI KOGYO KABUSHIKI KAISHA |
发明人 |
ISHIMURA, HIDEKAZU;KOMOTO, HIROSHI;KAI, ISAO |
分类号 |
C08L61/06;C08L63/02;(IPC1-7):C08L63/00;C08L61/10 |
主分类号 |
C08L61/06 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|