Biosensor with a sensing surface on an interlayer dielectric

摘要

The present disclosure relates to an integrated chip having an integrated bio-sensor having horizontal and vertical sensing surfaces. In some embodiments, the integrated chip has a sensing device disposed within a semiconductor substrate. A back-end-of the line (BEOL) metallization stack with a plurality of metal interconnect layers electrically coupled to the sensing device is arranged within an inter-level dielectric (ILD) layer overlying the semiconductor substrate. A sensing well is located within a top surface of the ILD layer. The sensing well has a horizontal sensing surface extending along a top surface of a first one of the plurality of metal interconnect layers and a vertical sensing surface extending along a sidewall of a second one of the plurality of metal interconnect layers overlying the first one of the plurality of metal interconnect layers. The use of both horizontal and vertical sensing surfaces enables more accurate sensing.

主权项

1. An integrated chip, comprising:
a sensing device disposed within a semiconductor substrate; a back-end-of-the-line metallization stack comprising a plurality of metal interconnect layers electrically coupled to the sensing device and disposed within a dielectric structure overlying the semiconductor substrate, wherein the plurality of metal interconnect layers includes an overlying metal layer and a metal wire layer, and wherein the overlying metal layer is disposed over the metal wire layer; and a sensing well comprising a horizontal sensing surface extending along a top surface of the metal wire layer and a vertical sensing surface extending along a sidewall of a first portion of the overlying metal layer and a sidewall of a via disposed between the first portion of the overlying metal layer and the metal wire layer, wherein the vertical sensing surface comprises a nook located at a lower corner of the sensing well.