SEALED SEMICONDUCTOR DEVICE

摘要

PURPOSE:To prevent generation of stress and infiltration of humidity by expansion and contraction of resin by joining the contact conductive part between circuit substrate and metal substrate for loading chips, hollowing sealing semiconductor element and filling the space between both substrates with resin. CONSTITUTION:A die bonding part 3 is arranged at the recess 1a of metal substrate. A semiconductor element 4 is fixed by bonding to the die bonding part 3. This element 4 and a bonding part 2a are joined by a wire 5. These element 4, bonding part 2a and wire 5 are buffer coated with a resin 6. A conductive foil 2' is formed like a circuit pattern on the substrate 7 where a semiconductor chip A' is inversely loaded and a recess 7 which is larger than the recess 1a on the substrate 1 is formed. The contact conductive part 8 between the substrate 1 and substrate 7 is coupled and the clearance formed between the substrate 1 and recess 7a of substrate 7 is filled with the sealing resin 9.