发明名称 APPARATUS FOR PREVENTING DEFECT DUE TO INVALID OPERATION IN SUPERSONIC BONDING
摘要 PURPOSE:To prevent defects due to invalid bonding operation, by detecting simultaneously any disengagement of the wire from a tool and disengagement from a clamp. CONSTITUTION:Distribution terminals of a power source 6 are connected to a clamp 2 and a horn 3a for supporting a tool 3 provided in a supersonic bonding apparatus. A wire 1 is supported by the clamp 2 and is inserted through a guide hole of the tool. When the inserted wire is contacted with the guide hole, a closed circuit is formed through this wire 1. A microcurrent detector 7 is provided in the circuit of the power source 6 so that microcurrent which is caused to flow by a potential difference between the tool 3 and the clamp 2 is detected through the wire 1. When a detection signal is detected, a holding device 8 is connected to the detector 7 for holding the signal for a given period of time. The holding device 8 determines, when the wire 1 inserted through the guide hole is removed from the guide hole in an instant, that the wire has been disengaged therefrom.
申请公布号 JPS6181642(A) 申请公布日期 1986.04.25
申请号 JP19840203157 申请日期 1984.09.28
申请人 NEC CORP 发明人 SAKURAI KEIZO
分类号 H01L21/60;H01L21/607 主分类号 H01L21/60
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