| 摘要 |
PURPOSE:To improve the efficiency of a material usage, to eliminate the production of a disposal and to form a bump inexpensively by bonding a soldering solution to the end of a solder supplying pin, and bonding the solder bonded to the end to a pad. CONSTITUTION:Pins 1 are fixedly disposed in a holding frame 4 at a corresponding pitch, for example, at the position of pads 3 of semiconductor chip 2 for forming a bump, and the pins 1 are secured to the bottom 5 in the frame 4. The frame 4 is provided with an arm 6 on the outer wall 7 of the bottom 5 to move upward and downward, and rightward and leftward to construct a solder supply unit, and solders are bonded to the ends of the pins 1 by dipping in a solder bath tank together with the pads 3. Thus, the solder supply unit is disposed in contact on the bump of a semiconductor chip such as an LSI chip 2 in the state that solder spheres are bonded to the ends of the pins 1. The edge of the chip is positioned by taking by an ITV camera so that the pins 1 are correctly contacted on the pads 2 of the chip 1. At this time the atmosphere is heated to high temperature set to the melting temperature of the solder. |
