摘要 |
PURPOSE:To reduce the generation of stress strain during curing by reflecting or scattering curing light from an optical mechanism to a position nearby a photosetting adhesive when optical parts and an optical fiber are connected together with the adhesive. CONSTITUTION:A V groove 7 as a positioning guide for an input/output optical fiber 1 is formed at both sides of a package substrate 5 formed by working a material such as metal, glass, and ceramics and a photoconductive substrate 3 is adhered at a desired position of the center part; and one drop of the photosetting adhesive is applied to the input/output optical fiber 1 along the V grooves 7 and set by being irradiated by an ultraviolet-ray irradiating device to connect an optical branch waveguide 2 to the optical fiber. An ultraviolet-ray reflection mirror 6 is formed previously in the substrate 4 during this connecting operation and direct light from a light source or transmitted light from the optical fiber 1 is reflected to illuminate the adhesion surface 5, thereby increasing the intensity of ultraviolet rays. |