发明名称 METHOD FOR PACKAGING OPTICAL PARTS
摘要 PURPOSE:To reduce the generation of stress strain during curing by reflecting or scattering curing light from an optical mechanism to a position nearby a photosetting adhesive when optical parts and an optical fiber are connected together with the adhesive. CONSTITUTION:A V groove 7 as a positioning guide for an input/output optical fiber 1 is formed at both sides of a package substrate 5 formed by working a material such as metal, glass, and ceramics and a photoconductive substrate 3 is adhered at a desired position of the center part; and one drop of the photosetting adhesive is applied to the input/output optical fiber 1 along the V grooves 7 and set by being irradiated by an ultraviolet-ray irradiating device to connect an optical branch waveguide 2 to the optical fiber. An ultraviolet-ray reflection mirror 6 is formed previously in the substrate 4 during this connecting operation and direct light from a light source or transmitted light from the optical fiber 1 is reflected to illuminate the adhesion surface 5, thereby increasing the intensity of ultraviolet rays.
申请公布号 JPS61212808(A) 申请公布日期 1986.09.20
申请号 JP19850052195 申请日期 1985.03.18
申请人 TOSHIBA CORP 发明人 MINEO KOKI
分类号 G02B6/32;G02B6/30;G02B7/02 主分类号 G02B6/32
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