发明名称 CONNECTION OF SEMICONDUCTOR CIRCUIT
摘要 PURPOSE:To allow high-speed signal transmission on a chip formed with trip lines by a method wherein signal transmission lines of an integrated circuit chip and a ground surface are connected with flip chip method, and the ground is connected in a form where it surrounds the connected section of the signal transmission. CONSTITUTION:A connecting terminal 14 for a signal transmission is arranged around an integrated circuit chip 4, and a connecting terminal 15 for the ground surface whose one part is opened is connected surrounding each connecting terminal 14. All the connecting terminals are connected with flip chip method. Moreover, one part of the ground surface connecting terminal 15 at the outside is opened to pass through the wiring with which the internal signal transmission connecting terminal 14 is connected to the inter-chip wiring. Thus, in a chip such as a Josephson integrated circuit, the current flowing in a power line is larger approx. 2-3 digits than that flowing in a signal line so that the crosstalk due to the crosstalk can be prevented by applying this connecting method to a power line.
申请公布号 JPS61296750(A) 申请公布日期 1986.12.27
申请号 JP19850137689 申请日期 1985.06.26
申请人 发明人
分类号 H05K1/02;H01L21/60;H05K1/11 主分类号 H05K1/02
代理机构 代理人
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