METHOD FOR PRODUCING METAL FOIL LAMINATED FILM AND CIRCUIT BOARD HAVING METAL FOIL LAMINATED FILM PRODUCED BY THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a method for producing a metal foil laminated film having high adhesiveness and high desmear treatment resistance, and a circuit board having a metal foil laminated film produced by the same.SOLUTION: The method for producing a metal foil laminated film is provided in which a metal foil is laminated on at least one surface of a heat resistant resin film through a heat resistant resin layer. The method has: (1) a step of subjecting a surface on which the heat resistant resin layer is formed, of the heat resistant resin film to discharge treatment; (2) a step of applying a heat resistant resin composition used in the heat resistant resin layer onto the surface of the heat resistant resin film which has been subjected to the discharge treatment to form the heat resistant resin layer; (3) a step of laminating a metal foil on the surface on which the heat resistant resin layer is formed; and (4) a step of subjecting a laminate on which the metal foil is laminated to heat treatment at 250-400°C, the steps (1) to (4) being performed in the above order.SELECTED DRAWING: None