| 发明名称 |
COUPLING OF SIDE SURFACE CONTACTS TO A CIRCUIT PLATFORM |
| 摘要 |
An apparatus relates generally to a microelectromechanical system component. In such an apparatus, the microelectromechanical system component has a lower surface, an upper surface, first side surfaces, and second side surfaces. Surface area of the first side surfaces is greater than surface area of the second side surfaces. The microelectromechanical system component has a plurality of wire bond wires attached to and extending away from a first side surface of the first side surfaces. The wire bond wires are self-supporting and cantilevered with respect to the first side surface of the first side surfaces. |
| 申请公布号 |
US2016322325(A1) |
申请公布日期 |
2016.11.03 |
| 申请号 |
US201514698684 |
申请日期 |
2015.04.28 |
| 申请人 |
INVENSAS CORPORATION |
发明人 |
CO Reynaldo;SUBIDO Willmar;NGUYEN Hoang;CARA Marjorie;ZOHNI Wael;LATTIN Christopher W. |
| 分类号 |
H01L23/00;B81C1/00;B23K20/00;B81B7/00 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An apparatus, comprising:
a microelectromechanical system component having a lower surface, an upper surface, first side surfaces, and second side surfaces; wherein surface area of the first side surfaces is greater than surface area of the second side surfaces; the microelectromechanical system component having a plurality of wire bond wires attached to and extending away from a first side surface of the first side surfaces; the plurality of wire bond wires having attached thereto solder balls at distal ends of the plurality of wire bond wires with respect the first side surface; and wherein the wire bond wires are self-supporting and cantilevered with respect to the first side surface of the first side surfaces with the solder balls attached thereto. |
| 地址 |
San Jose CA US |
