发明名称 Multi-level signaling
摘要 Apparatus are disclosed, such as those involving a transmitter circuit that is configured to generate multi-level signals based on a plurality of data digits. One such transmitter circuit includes a signal output and an encoder configured to provide control signals based at least partially on the plurality of data digits. The transmitter circuit also includes a first set of switches configured to receive one or more of the control signals, and to selectively conduct a first or second voltage reference to the signal output. The transmitter circuit further includes first and second voltage drop circuits that provide third and fourth voltage references, respectively. The third and fourth voltage references have voltage levels between those of the first and second voltage references. The transmitter circuit also includes a second set of switches configured to receive one or more of the control signals, and selectively conduct the third or fourth voltage reference to the signal output.
申请公布号 US9509535(B2) 申请公布日期 2016.11.29
申请号 US201514918346 申请日期 2015.10.20
申请人 Micron Technology, Inc. 发明人 Hollis Timothy M.
分类号 H04L25/49;H03K19/00 主分类号 H04L25/49
代理机构 Dorsey & Whitney LLP 代理人 Dorsey & Whitney LLP
主权项 1. An electronic device comprising: a first integrated circuit die comprising a transmitter circuit, the transmitter circuit comprising an encoder configured to generate at least three control signals and a push: pull circuit configured to generate a multi-level signal having more than two signal levels, wherein each of the more than two signal levels corresponds to a different data input value provided to the encoder, wherein the push-pull circuit includes a first set of switches and a second set of switches configured to receive the at least control signals, and further includes first and second voltage drop circuits both coupled to the first set of switches; and a second integrated circuit die stacked with the first integrated circuit die, the second integrated circuit die configured to receive the multi-level signal from the first integrated circuit die.
地址 Boise ID US