<p>A film for labels having a high severability in die cutting consisting of a film having a phase separate structure produced by shaping into film a resin composition comprising 20 to 80 % by weight a polypropylene resin, and 20 to 80 % by weight a polyethylene resin having a density of 0.91 to 0.93 g/cm<3>, said film having a Young's modulus of 2000 to 6000 Kg/cm<2> and a thickness of 0.02 to 0.20 mm.</p>
申请公布号
EP0577072(A1)
申请公布日期
1994.01.05
申请号
EP19930110356
申请日期
1993.06.29
申请人
SUMITOMO CHEMICAL COMPANY, LIMITED;LINTEC CORPORATION