发明名称 |
Plastic-encapsulated semiconductor device |
摘要 |
A semiconductor chip is positioned between encapsulating sheets. The encapsulating sheets each have a surface that is highly adhesive and a surface that is less adhesive. The surface of the encapsulating sheet that is highly adhesive contacts the chip. The surface that is less adhesive contacts a mold. Subsequently, encapsulation is carried out by molding. A soldering resistance can be improved without reducing a mold releasing property.
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申请公布号 |
US5641997(A) |
申请公布日期 |
1997.06.24 |
申请号 |
US19940305478 |
申请日期 |
1994.09.13 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
OHTA, HIDEO;OKUYAMA, TETSUO;FUJIEDA, SHINETSU;KAJIURA, SADAO;YOSHIZUMI, AKIRA |
分类号 |
C08L63/00;H01L21/56;H01L23/29;H01L23/433;(IPC1-7):H01L23/29 |
主分类号 |
C08L63/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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