发明名称 |
RADIATION CURABLE RESIN COMPOSITION |
摘要 |
A radiation curable composition comprising: (A) at least one compound containing a (meth)acrylate group represented by formula (1), wherein R<1> is a hydrogen atom or a methyl group, R<2> is an alkylene group or a hydroxyalkylene group having 2 to 6 carbon atoms, R<3> is a divalent organic group, n is a number of 1 to 10, m is an integer of 0 or 1, and Ar<1> and Ar<2> are independently a group comprising an aromatic ring; (B) at least one compound derived from trishydroxyethyl isocyanurate, and containing at least one (meth)acrylate group; and (C) at least one radiation polymerization initiator. The radiation curable resin composition affords a high productivity, exhibits high transparency, and produces molded articles exhibiting minimal coloration upon exposure to light, superior dimensional precision, high heat resistance, only slight adhesion to substrates under high temperature conditions. The composition is very useful for manufacturing molding articles. |
申请公布号 |
WO9801778(A1) |
申请公布日期 |
1998.01.15 |
申请号 |
WO1997NL00388 |
申请日期 |
1997.07.07 |
申请人 |
DSM N.V.;JAPAN SYNTHETIC RUBBER CO., LTD.;JAPAN FINE COATINGS CO., LTD.;UKON, MASAKATSU;TAKAHASHI, TOSHIHIKO;UKACHI, TAKASHI |
发明人 |
UKON, MASAKATSU;TAKAHASHI, TOSHIHIKO;UKACHI, TAKASHI |
分类号 |
C08F4/00;C08F2/48;C08F220/30;C08F220/36;C08F290/00;C08F290/06;G02B1/04;G02B1/12;(IPC1-7):G02B1/04 |
主分类号 |
C08F4/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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