发明名称 Modular relay
摘要 PCT No. PCT/EP95/01657 Sec. 371 Date Sep. 26, 1996 Sec. 102(e) Date Sep. 26, 1996 PCT Filed May 2, 1995 PCT Pub. No. WO95/30995 PCT Pub. Date Nov. 16, 1995The modular relay has a base (1) on which a relay system (2, 3, 4) is constructed, as well as a printed circuit board (6) which stands upright on the base. Contact elements (41c, 42c, 43) of the relay are directly connected to flat connectors in the base, via conductor elements. Further conductor elements in the base likewise form flat connectors as connections for a modular circuit which is arranged on the printed circuit board. All conductor elements of the base additionally form solder connecting pins (51b to 56b), which are integrally formed, which all emerge in a row on one side wall of the base, and which are soldered to the printed circuit board in the lower edge region of said printed circuit board. This results in a compact modular structure for a relay having a maximum number of connecting elements, the allocation of these connecting elements being variable for different modular circuits.
申请公布号 US5808533(A) 申请公布日期 1998.09.15
申请号 US19960704762 申请日期 1996.09.26
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 BUESCHER, THOMAS;REISS, HEIKO
分类号 H01H50/02;H01H50/04;H01H50/14;(IPC1-7):H01H9/02;H01H13/04 主分类号 H01H50/02
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