| 发明名称 |
LEAD-FREE SOLDER |
| 摘要 |
A solder composition comprising: 15.0 to 30.0 % bismuth; 1.0 to 3.0 % silver, and optionally comprising 0 to 2.0 % copper and 0 to 4.0 % antimony and incidental impurities, the balance being tin. |
| 申请公布号 |
WO9848069(A1) |
申请公布日期 |
1998.10.29 |
| 申请号 |
WO1998AU00291 |
申请日期 |
1998.04.22 |
| 申请人 |
WALTON, JUDITH, LESLEY;WALTON, IAN, NOEL |
发明人 |
WALTON, IAN, NOEL |
| 分类号 |
B23K35/26;C22C13/02;H05K3/34;(IPC1-7):C22C13/02 |
主分类号 |
B23K35/26 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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